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  t able of contents page ve rsion 1.0 service manual philips gb ? all right s reserved. no part of this publication may be reproduced, stored in aretrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise without the prior permission of philips. class 1 laser product service dvd player copyright 2011 philips consumer electronics b.v. eindhoven, the netherlands published by lll - 1220 bu avm printed in the netherlands subject to modification 3141 785 38080 DVP3680KX DVP3680KX/77/78 specification............................................................................1-2 safety instruction,warning & notes........................................1-3 mechanical and dismantling instruction..................................2-1 software upgrades..................................................................3-1 trouble shooting ....................................................................4-1 wiring diagram........................................................................5-1 electrical diagram and print-layout.........................................6-1 mechanical exploded view.....................................................7-1 revision list............................................................................8-1 free datasheet http://www..net/
safet y instruction 1. general saf ety safety regulations require that during a repair: . connect the unit to the mains via an isolation transformer. . replace safety components indicated by the symbol , onl y by components identical to the original ones. any other component substitution (other than original type) may increase risk of fire or electrical shock hazard. safety regulations require that after a repair, you must return the unit in its original condition. pay, in particular, attention to the following points: . route the wires/cables correctly, and fix them with the mounted cable clamps. . check the insulation of the mains lead for external damage. . check the electrical dc resistance between the mains plug and the secondary side: 1) unplug the mains cord, and connect a wire between the two pins of the mains plug. 2) set the mains switch the on position (keep the mains cord unplug). 3) measure the resistance value between the mains plug and the front panel, controls, and chassis bottom. 4) repair or correct unit when the resistance measurement is less than 1m ? . 5) v erify this, before you return the unit to the customer/user (ref. ul-standard no. 1492). 6) switch the unit off, and remove the wire between the two pins of the mains plug. 2.laser safety this unit employs a laser. only qualified service personnel may remove the cover, or attempt to service this device (due to possible eye injury). laser device unit type : semiconductor laser gaalas wavelength : 650nm (dvd) : 780nm (vcd/cd) output power : 7mw (dvd) : 10mw (dvd /cd) beam divergence: 60 degree note: use of controls or adjustments or performance of procedure other than those specified herein, may result in hazardous radiation exposure. avoid direct exposure to beam. safet y instruction, w arnin g & notes 1-2 free datasheet http://www..net/
w arning 1.general . all ics and many other semiconductors are susceptible to electrostatic discharges (esd). careless handing during repair can reduce life drastically. make sure that, during repair, you are at the same potential as the mass of the set by a wristband with resistance. keep components and tools at this same potential. available esd protection equipment: 1) complete kit esd3 (small tablemat, wristband, connection box, extension cable and earth cable) 4822 310 10671. 2) wristband tester 4822 344 13999. . be careful during measurements in the live voltage section. the primary side of the power supply , including the heat sink, carries live mains voltage when you connect the player to the mains (even when the player is off!). it is possible to touch copper tracks and/or components in this unshielded primary area, when you service the player. service personnel must take precautions to prevent touching this area or components in this area. a lighting stroke and a stripe-marked printing on the printed wiring board, indicate the primary side of the power supply. . never replace modules, or components, while the unit is on. 2. laser . the use of optical instruments with this product, will increase eye hazard. . only qualified service personnel may remove the cover or attempt to service this device, due to possible eye injury. . repair handing should take place as much as possible with a disc loaded inside the player. . text below is placed inside the unit, on the laser cover shield: notes: manufactured under licence from dolby laboratories. the double-d symbol is trademarks of dolby laboratories, inc. all rights reserved. caution: visible and invisible laser radiation when open, avoid exposure to beam. 1-3 free datasheet http://www..net/
 6huylfh+lqwv  &$87,21 &+$5*('&$3 $&,7256217+(6(592%2$5'0$<'$0$*(7+('5,9( (/(&7521,&6:+(1&211(&7,1*$1(:'5,9(7+$7?6:+<%(6,'(67+(6$)(7< 0($685(6/,.(  ? 6:,7&+2))32:(56833/<  ? (6'3527(&7,21 $'',7,21$/$&7,2160867%(7$.(1%<7+(5(3$,57(&+1,&,$1  7khiroorzlqjvwhsvkdyhwrehgrqhzkhquhsodflqjwkhghihfwl yhordghu    'lvpdqwolqjriwkhordghuwrdffhvvwkh(6'surwhfwlrqsrl qwliqhfhvvdu\    6roghuwkh(6'surwhfwlrqsrlqw        'lvfrqqhfwh[irlofdeohiurpwkhghihfwlyhordghu   3xwdsdshufolsrqwkhh[irlowrvkruwflufxlwwkhfrqwdfwv ?j    5hsodfhwkhghihfwlyhordghuzlwkdqhzordghu   5hpryhsdshufolsiurpwkhh[irlodqgfrqqhfwlwwrwkhqhzordghu   5hpryhvroghumrlqwrqwkh(6'surwhfwlrqsrlqw  $77(17,217khodvhuglrghriwklvordghulvsurwhfwhgdjdlqvw(6'e\dvroghumrlqwzklfkvkruwflufxlwvwkhodvhuglrghwrjurxqg )rusurshuixqfwlrqdolw\riwkhordghuwklvvroghumrlqwpxvwehuhpryh diwhufrqqhfwlrqordghuwrwkhvhw     2qo\dssolfdeohirughihfwlyhordghuqhhghgwrehvhqwedfnw rvxssolhuiruidloxuhdqdo\vlvdqgwrvxssruwedfnfkdujlqj   hylghqfh  7klvlvdovrdssolfdeohirudoosduwqhuvklszrunvkrsv (6'surwhfwlrqsrlqwlvdffhvvleohiurpwrsriordghu solder joint 1-4 free datasheet http://www..net/
lead-free r equirement for service indentification: regardl ess of special logo (not always indicated) one must treat all sets from 1.1.2005 onwards, according nex t rules. important note : in fact also products a little older can also be treated in this way as long as you avoid mixing solder-alloys (leaded/ lead-free). so best to always use sac305 and the higher temperatures belong to this. due to lead-free technology some rules have to be respected by the workshop during a repair: x use only lead-free solder alloy philips sac305 with order code 0622 149 00106. if lead-free solder-paste is required, please contact the manufacturer of your solder-equipment. in general use of solder-paste within workshops should be avoided because paste is not easy to store and to handle. x use only adequate solder tools applicable for lead-free solder alloy. the solder tool must be able o to reach at least a solder-temperature of 400c, o to stabilize the adjusted temperature at the solder-tip o to exchange solder-tips for different applications. x adjust your solder tool so that a temperature around 360c C 380c is reached and stabilized at the solder joint. heating-time of the solder-joint should not exceed ~ 4 sec. avoid temperatures above 400c otherwise wear-out of tips will rise drastically and flux-fluid will be destroyed. to avoid wear-out of tips switch off un-used equipment, or reduce heat. x mix of lead-free solder alloy / parts with leaded solder alloy / parts is possible but philips recommends strongly to avoid mixed solder alloy types (leaded and lead-free). if one cannot avoid, clean carefully the solder-joint from old solder alloy and re-solder with new solder alloy (sac305). x use only original spare-parts listed in the service-manuals. not listed standard-material (commodities) has to be purchased at external companies. x special information for bga-ics: - al ways use the 12nc-recognizable soldering temperature profile of the specific bga (for de-soldering always use highest lead-free temperature profile, in case of doubt) - lead free bga-ics will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) to protect the ic against moisture. after opening, dependent of msl-level seen on indicator-label in the bag, the bga-ic possibly still has to be baked dry. this will be communicated via ays-website. do not re-use bgas at all. x for sets produced before 1.1.2005, containing leaded soldering-tin and components, all needed spare-parts will be available till the end of the service-period. for repair of such sets nothing changes. x on our website: www.atyourservice.ce.philips.com y ou find more information to: bga-de-/soldering (+ baking instructions) heating-profiles of bgas and other ics used in philips-sets you will find this and more technical information within the magazine, chapter workshop news. for additional questions please contact your local repair-helpdesk. notes 1- 5 free datasheet http://www..net/
repair scenario matrix DVP3680KX /77/78 main board c/m front&power&usb board c/m *m:module level repair *c:component level repair *x:used type/versions board in used pcb location: 1-6 free datasheet http://www..net/
mechanical and dismantling instructions dismantling instruction t he following guidelines show how to dismantle the player. step1: remove 5 screws around the top cover, and then remove the top cover (figure 1). figure 1 step2 : if it is necessary to dismantle loader or front panel, the front door should be removed first. (figure 2) note: make sure to operate gently otherwise the guider would be damaged. figure 2 2-1 pleas e kindly note that dismantle the front door assembly carefully to avoid damage tray and the front door. detailed information please refer to the model set. the sample is dvp3880k/98. free datasheet http://www..net/
mechanical and dismantling instructions dismantling instruction st ep3 : if the tray cant open in normal way, you can make it through the instruction as below (figure 3). note: make sure to operate gently otherwise the guider would be damaged. figure 3 step4 : dismantling front panel, disconnect the connectors (x p5 , xp6,xp7), need release 4 snaps of front panel & 2 snaps of bottom cabinet , then gently pull the panel out from the set. (figure 4 - figure 6) figure 4 2-2 detailed information please refer to the model set. free datasheet http://www..net/
2-3 mechanical and dismantling instructions dismantling instruction figure 5 figure 6 detailed information please refer to the model set. st ep6 : dismantling main board, first disconnect the connector (xp1), and then remove 5 screws. (figure 6) step7 : remove the 4 screws on power board to dismantle the power board. (figure 6) step5 : dismantling loader, disconnect the 3 connectors (xp2, xp3, xp4) aiming in the below figure, and remove 1 screw that connects the loader and the bottom cabinet. (figure 5) free datasheet http://www..net/
software upgrade prepar ation to upgrade software 1) start the cd burning software and create a new cd project (data disc) with the following setting: label: dvp3xxx (no need the label name) file name: dvpxxxx_xx.bin power on the set and open the tray, then press


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